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lapis semiconducto r FEDL9298-01 issue date: jul. 11, 2005 ml9298 12-hour system clock ic for 1/2 duty fluorescent display tubes 1/12 general description the ml9298 is a 12-hour system clock ic that drives 1/2 duty fluorescent display tubes. it has a wide range of power supply using an oscillation source of 4.194304 mhz. the ml9298 has a time adjustment function in hour, minute and 30-minute units, and the function has two adjustment modes, 1 push 1 adj and 2hz fast forward. additionally, it has a brightness adjustment function for the fluorescent display tube, providing four levels of brightness settings. features ? 12-hour system ? wide power supply range from 4 to 18v (built-in voltage regulator circuit) ? designed for 1/2 duty fluorescent display tubes ? 4.194304mhz (crystal oscillation) ? four levels of brightness settings ? package: 32-pin plastic ssop (ssop32-p-430-1.00-k) (ml9298mb)
FEDL9298-01 lapis semiconductor ml9298 2/12 block diagram frequency divide circuit 3v regulator high voltage circuit power-on reset circuit logic circuits vddin reset gr1 reset xt xt dim1 dim2 ms hs za a / c vddou t v cc grid decoder grid driver gr2 2a, 2d 4b, 4c, 2b segment driver time adjustment 2f second counter b lan k minute counter hour counter segment decoder f64hz t es t colsel 2c, col 2e 2g 3d, 1d 3e, 1e 3c, 1c 3g, 1g 3f, 1f 3b, 1b 3a, 1a
FEDL9298-01 lapis semiconductor ml9298 3/12 pin configuration (top view) v cc 1 32 gr2 vddout 2 31 gr1 vddin 3 30 2a, 2d t est 4 29 4b, 4c, 2b dim1 5 28 2f dim2 6 27 2c, col b lank 7 26 2e h s 8 25 2g m s 9 24 3d, 1d z a 10 23 3e, 1e a /c 11 22 3c, 1c xt 12 21 3g, 1g x t 13 20 3f, 1f (nc) 14 19 3b, 1b f64hz 15 18 3a, 1a gnd 16 17 colsel
FEDL9298-01 lapis semiconductor ml9298 4/12 pin description pin i/o pull-up/ pull-down description dim1 i pull-down dim2 i pull-down brightness switching pin. a/c i pull-up input pin with a pull-up resistor to reset the circuits inside this lsi at a ?l? level. set the reset pulse width to 2 ms or more. za i pull-up zero adjust pin. hs i pull-up hour digit adjustment pin. ms i pull-up minute digit adjustment pin. blank i pull-down blank input pin. display disappears at a ?l? level. colsel i ?? this is the input pin for selecting flashing or lighting of the colon output. "l" level : flashing, "h" level : lighting xt i x t o ?? crystal oscillation pin to connect a crystal and capacitors cx and cy externally. test i pull-up ic testing pin. leave this pin open or fix it to a ?h? level. f64hz o ?? 64hz signal output pin for oscillation frequency adjustment. gr1 gr2 o ?? output pins for the 1/2 duty fluorescent display tube grids. 1a, 3a to 2b, 4b, 4c o ?? output pins for the 1/2 duty fluorescent display tube anodes. v cc ? ?? power supply pin for high voltage. gnd ? ?? ground pin. vddout o ?? built-in regulator output pin for logic circuits. connect the pin to the vddin pin. vddin i ?? power supply pin for logic circuits. connect the pin to the vddout pin. nc ?? ?? nc pin. leave the pin open.
FEDL9298-01 lapis semiconductor ml9298 5/12 absolute maximum ratings parameter symbol condition rating unit power supply voltage (high voltage) v cc ta = 25c ?0.3 to 20 v power supply voltage (logic) vddin ta = 25c ?0.3 to 6.5 v input voltage (high voltage) v hi ta = 25c ?0.3 to v cc +0.3 v input voltage (logic) v li ta = 25c ?0.3 to vddin+0.3 v output voltage (high voltage) v ho ta = 25c ?0.3 to v cc +0.3 v output voltage (logic) v lo ta = 25c ?0.3 to vddin+0.3 v output current (high voltage) i ho ta = 25c ?30 to 3 ma output current (logic) i lo ta = 25c ?5 to 5 ma power dissipation p d ta ? 85c 350 mw storage temperature t stg ? ?55 to 150 c recommended operating conditions parameter symbol condition min. typ. max. unit power supply voltage (high voltage) v cc ? 4.0 12.0 18.0 v power supply voltage (logic) vddin ? 2.8 3.2 3.6 v operating temperature ta ? ?40 25 85 c crystal frequency f(x'tal) ? 4.194304 mhz
FEDL9298-01 lapis semiconductor ml9298 6/12 electrical characteristics dc characteristics (vcc = 4.0 to 18.0 v, vddin = 2.8 to 3.6 v, ta = ? 40 to 85c) parameter applicable pin symbol condition min. typ. max. unit "h" input voltage *1) v ih v cc = 4 to 18 v v cc ? 0.8 ? ? v "l" input voltage *1) v il v cc = 4 to 18 v ? ? v cc ? 0.2 v v cc = 12 v i ih1 vin = v cc 20 65 200 ? a v cc = 12 v dim1, dim2, blank , colsel i il1 vin = 0 v ? 2 ? 2 ? a v cc = 12 v i ih2 vin = v cc ? 2 ? 2 ? a v cc = 12 v za , hs , ms , a/c , test i il2 vin = 0 v ?200 ?65 ?20 ? a v cc = 12 v i ih3 vin = v cc ?2 ? 2 ? a v cc = 12 v input current colsel i il3 vin = 0 v ?2 ? 2 ? a v cc = 12 v v oh1 ioh1 = ? 1 ma v cc ?2.0 ? ? v v cc = 12 v *2) v ol1 iol1 = 0.55 ma ? ? 2 v v cc = 12 v v oh2 ioh2 = ? 2 ma v cc ?2.0 ? ? v v cc = 12 v *3) v ol2 iol2= 0.55 ma ? ? 2 v v cc = 12 v v oh3 ioh3 = ? 15 ma v cc ?2.0 ? ? v v cc = 12 v grid1, grid2 v ol3 iol3 = 0.55 ma ? ? 2 v v oh4 vddin = 3.0v ioh4 = ? 0.1ma vddin?0.5 ? ? v output voltage f64hz v ol4 vddin = 3.0v iol4 = 0.1ma ? ? 0.5 v dynamic supply current v cc i cc *4) ? 400 600 ? a * 1 ) applicable to the following pins: dim1, dim2, blank , test , za , hs , ma , a/c , and colsel * 2) applicable to the following segment output pins: 1a and 3a, 1b and 3b, 1c and 3c, 1d and 3d, 1e and 3e, 1f and 3f, 1g and 3g, 2g, 2e, and 2f * 3) applicable to the following segment output pins: 2a, 2d, 2b and 4b, 4c and 2c, and col *4) f = 4.194304 mhz, cg = cd = 33pf, v cc = 12v, open input, and non-loaded output
FEDL9298-01 lapis semiconductor ml9298 7/12 functional description time base b u ilt-in 4.194304mhz cr ystal oscillation circuit (amp, feedback resistor) * keep crystal and external capacitors as clos e to this lsi as possible to minimize connection wiring. * the values of external components, such as crystal and capacitors, should be determined including capacitance of user's circuit boards. it is recommended to contact a crystal manufacturer. 7-segment display format display device d y namic drive 4-digit fluorescent display tube (with colon) relationship between anode/grid output and display brightness switching function 4 - level brightness settings (frequency ?? 256 hz, gap between gr1 and gr2 at 1/2 duty ?? 32 ? s) switch pin name dim1 dim2 operating mode l l f = 256 hz, 1/2 duty (50 ? display) h l f = 256 hz, 1/4 duty (25 ? display) l h f = 256 hz, 1/8 duty (12.5 ? display) h h f = 256 hz, 1/16 duty (6.25 ? display) display mode 4 - digit hour and minute display in 12-hour system hour display 1 to 12 minute display 00 to 59 no time display when the most significant digit is 0 (most significant digit zero suppress function) a b c d e f g (7 segments) gr2 gr1 2c digit2 2f 2a 2g 2d 2e 2b col col colon 3f 3a 3g 3d 3e 3b 3c digit3 4b 4c digit4 1f 1a 1g 1d 1b 1c digit1 1e
FEDL9298-01 lapis semiconductor ml9298 8/12 time adjustment h o ur/minute fast-forwarding function hour and minute can be fast-forwarded separately. the hs (hours set) pin fast-forwards the hour digits, and the ms (minutes set) pin fast-forwards the minute digits individually at 2hz. one push counts one hour or one minute. when continuously pushed, hour or minute is incremented at 2hz. the hs and ms pins are held at a ?h? level by a pull-up resistor in the open state, being in the no active state. these pins are placed in the active state by driving them at a ?l? level externally. the fast-forwarding of the hour and minute digits can be performed simultaneously. when fast-forwarding the hour digits, the lower counter continues a regular operation, but the carry-over from the minute to the hour is not performed. when fast-forwarding the minute digits, carry over to the hour digits is not performed. zero adjustment function ( ? 3 0 minute reset to zero) the za (zero adjust) pin is held at a ?h? level by a pull-up resistor in the open state, being in the no active state. this pin is placed in the active state by driving it at a ?l? level externally so that hours, minutes and seconds can be adjusted to zeros. if the minute digits is less than 30 minutes, the minute and second digits are reset to 00?00?. also, if the minute digits exceed 30 minutes, the minute and second digits are reset to 00?00?, and the hour digits are carried over. moreover, the counter below seconds is reset up to 8 hz. (x ? 1) hours 30 minutes 00 seconds x hours 00 minutes 00 seconds ? x hours 00 minutes 00 seconds (x) hours 29 minutes 59 seconds (x) hours 30 minutes 00 seconds x hours 59 minutes 59 seconds ? (x ? 1) hours 00 minutes 00 seconds (x ? 1) hours 29 minutes 59 seconds blanking of display b l anking occurs in display by driving the blank pin at a ?l? level externally. inputs from hs , ms , and za pins are disabled during blanking. f64hz pin t h is is the output pin for oscillation frequency adjustment, and constantly outputs a 64hz signal. external reset t h is device can be reset by placing the a/c pin at a ?h? level. after reset, the display starts at ?1: 00?. built-in regulator circuit t h e built-in regulator circuit reduces the power supply voltage (v cc ) for the high voltage to the power supply voltage for logic , which is output to the vddout pin. power is supplied to logic circuitry by connecting the vddout pin to the vddin pin. power-on reset t h e power-on reset circuit built in this device eliminates the need for providing an external reset circuit. * do the followings to operate the power-on reset circuit properly: - make a slope of a rise time of v cc to a voltage equal to or larger than 8v/ms. - connect a smoothing capacitor of 1000 pf ? 20% or more between the vddout pin and gnd.
FEDL9298-01 lapis semiconductor ml9298 9/12 test pin t h is is the pin for testing this device. this pin should be left open or fixed at a ?h? level when not used. removal of chatters t h ree ms , hs and za input pins are connected to the chatter removing circuits internally, and therefore chatters within 15.625 msec for each pin can be removed inside the device. colon flashing/lighting select function f l ashing or lighting of a colon can be selected by this colsel pin. colsel operating mode l flashing at 1 hz h lighting
FEDL9298-01 lapis semiconductor ml9298 10/12 package dimensions ssop32-p-430-1.00-k mirror finish package material epoxy resin lead frame material 42 alloy pin treatment solder plating ( 5 m) package weight (g) 0.60 typ. 5 rev. no./last revised 3/dec. 5, 1996 notes for mounting the surface mount type package the surface mount type packages are very susceptible to he at in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact rohm's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). ( unit: mm )
FEDL9298-01 lapis semiconductor ml9298 11/12 revision history page document no. date previous edition current edition description pedl9298-01 dec. 1, 2004 ? ? preliminary edition 1 FEDL9298-01 july. 11, 2005 ? ? final edition 1
FEDL9298-01 lapis semiconductor ml9298 12/12 notice no copying or reproduction of this document, in part or in whole, is permitted without the consent of lapis semiconductor co., ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing lapis semiconductor's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from lapis semiconductor upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, lapis semiconductor shall bear no responsibility for such damage. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. lapis semiconductor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by lapis semiconductor and other parties. lapis semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-a utomation equipment, communication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while lapis semiconductor always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe designs. lapis semiconductor shall bear no responsibility whatsoever for your use of any product outside of the pr escribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a me dical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). lapis semiconductor shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specified herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law. copyright 2005 - 2011 lapis semiconductor co., ltd.

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